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San Diego State University

Department of Electrical and Computer Engineering

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Power Integrity Modeling and Design for Semiconductors and Systems

Prentice Hall, November 29, 2007, 496 pages

  • Introduces power delivery network components, analysis, high-frequency measurement, and modeling requirements
  • Presents these and other advanced case studies: high-speed servers, high-speed differential signaling, chip package analysis, embedded decoupling capacitors, and electromagnetic bandgap structures
  • Translated to Japanese and simplified Chinese

book cover

Publications in mybib.bib [rss]

Book

[2007] Power Integrity Modeling and Design for Semiconductors and Systems (Madhavan Swaminathan, A. Ege Engin), Prentice Hall Press, 2007. (sample chapter) [bib]

Book Chapter

[2008] Chapter 4: Mixed Signal Design; In Introduction to System-on-Package (SOP); Edited by Rao R. Tummala and Madhavan Swaminathan (Madhavan Swaminathan, A. Ege Engin, Vinu Govind, Sidharth Dalmia, Amit Bavisi), McGraw-Hill, 2008. [bib]

Refereed Articles

[2018] Stepped-Impedance Common-Mode Filter for Differential Lines Enhanced With Resonant Planes (A. E. Engin, N. Modi, H. Oomori), In IEEE Transactions on Electromagnetic Compatibility, volume , 2018. [bib] [pdf] [doi]
[2018] Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines (A. E. Engin, I. Ndip, K. Lang, G. Aguirre), In IEEE Transactions on Electromagnetic Compatibility, volume , 2018. [bib] [pdf] [doi]
[2018] Closed-Form Multipole Debye Model for Time-Domain Modeling of Lossy Dielectrics (A. E. Engin, I. Ndip, K. Lang, J. Aguirre), In IEEE Transactions on Electromagnetic Compatibility, volume , 2018. [bib] [pdf] [doi]
[2018] Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise (A. E. Engin, I. Ndip, K. D. Lang, G. Aguirre), In IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 8, 2018. [bib] [pdf] [doi]
[2017] Power Plane Filter Using Higher Order Virtual Ground Fence (A. E. Engin, I. Ndip, K. D. Lang, G. Aguirre), In IEEE Transactions on Components, Packaging and Manufacturing Technology, volume PP, 2017. [bib] [pdf] [doi]
[2016] Power Archipelago for Filtering Power Plane Noise (A. E. Engin, C. Fergusson, Q. F. Su, J. Aguirre), In IEEE Transactions on Electromagnetic Compatibility, volume 58, 2016. [bib] [pdf] [doi]
[2014] A Modeling Approach for Predicting the Effects of Dielectric Moisture Absorption on the Electrical Performance of Passive Structures (Brian Curran, Ivan Ndip, Ege Engin, Jorg Bauer, Harald Poetter, Klaus-Dieter Lang, Herbert Reichl), In Journal of Microelectronics and Electronic Packaging, volume 11, 2014. [bib] [pdf] [doi]
[2014] Passive Multiport RC Model Extraction for Through Silicon Via Interconnects in 3-D ICs (A.E. Engin), In Electromagnetic Compatibility, IEEE Transactions on, volume PP, 2014. [bib] [pdf]
[2013] Virtual Ground Fence for GHz Power Filtering on Printed Circuit Boards (A.E. Engin, J. Bowman), In Electromagnetic Compatibility, IEEE Transactions on, volume 55, 2013. [bib] [pdf]
[2013] Modeling of Crosstalk in Through Silicon Vias (A.E. Engin, S.R. Narasimhan), In Electromagnetic Compatibility, IEEE Transactions on, volume 55, 2013. [bib] [pdf] [doi]
[2012] Automated Complex Permittivity Characterization of Ceramic Substrates Considering Surface-Roughness Loss (A. Ege Engin, Pavithra Pasunoori), In Journal of Microelectronics and Electronic Packaging, volume 9, 2012. [bib] [pdf]
[2011] Integration of Planar Antennas Considering Electromagnetic Interactions at Board Level (F. Ohnimus, G. Fotheringham, I. Ndip, A. A. Engin, S. Guttowski, H. Reichl, K. Lang), In Electromagnetic Compatibility, IEEE Transactions on, volume PP, 2011. [bib] [pdf] [doi]
[2011] Prediction and Comparison of High-Performance On-Chip Global Interconnection (Yulei Zhang, Xiang Hu, A. Deutsch, A.E. Engin, J.F. Buckwalter, Chung-Kuan Cheng), In Very Large Scale Integration (VLSI) Systems, IEEE Transactions on, volume 19, 2011. [bib] [pdf] [doi]
[2010] An Arnoldi Algorithm for Power-Delivery Networks With Variable Dielectric Constant and Loss Tangent (A.E. Engin), In Electromagnetic Compatibility, IEEE Transactions on, volume 52, 2010. [bib] [pdf] [doi]
[2010] Efficient Sensitivity Calculations for Optimization of Power Delivery Network Impedance (A.E. Engin), In Electromagnetic Compatibility, IEEE Transactions on, volume 52, 2010. [bib] [pdf] [doi]
[2010] Extraction of Dielectric Constant and Loss Tangent Using New Rapid Plane Solver and Analytical Debye Modeling for Printed Circuit Boards (A. E. Engin), In Microwave Theory and Techniques, IEEE Transactions on, volume 58, 2010. [bib] [pdf] [doi]
[2009] Fast EM/Circuit Transient Simulation Using Laguerre Equivalent Circuit (SLeEC) (K. Srinivasan, P. Yadav, A.E. Engin, M. Swaminathan, Myunghyun Ha), In IEEE Transactions on Electromagnetic Compatibility, volume 51, 2009. [bib] [doi]
[2009] Electromagnetic Band Gap Synthesis Using Genetic Algorithms for Mixed Signal Applications (Tae Hong Kim, M. Swaminathan, A.E. Engin, B.J. Yang), In IEEE Transactions on Advanced Packaging, volume 32, 2009. [bib] [doi]
[2008] Improvements in Noise Suppression for I/O Circuits Using Embedded Planar Capacitors (Prathap Muthana, Krishna Srinivasan, A. Ege Engin, Madhavan Swaminathan, Rao Tummala, Venkatesh Sundaram, Boyd Wiedenman, Daniel Amey, Karl Dietz, Sounak Banerji), In IEEE Transactions on Advanced Packaging, volume 31, 2008. [bib]
[2008] Accurate Transient Simulation of Interconnects Characterized by Band- Limited Data With Propagation Delay Enforcement in a Modified Nodal Analysis Framework (Subramanian N. Lalgudi, Ege Engin, Giorgio Casinovi, Madhavan Swaminathan), In IEEE Transactions on Electromagnetic Compatibility, volume 50, 2008. [bib]
[2007] Miniaturization of Planar {EBG} Structure Formed in Power/Ground Plane of Printed Circuit Board to Suppress {EMI} and Electromagnetic Noise (in Japanese) (Yoshitaka Toyota, Arif Ege Engin, Madhavan Swaminathan, Kengo Iokibe, Ryuji Koga), In IEICE Transactions on Communications, volume J90-B, 2007. [bib]
[2007] Design, Modeling and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package (Prathap Muthana, A. Ege Engin, Madhavan Swaminathan, Rao Tummala, Venkatesh Sundaram, Boyd Wiedenman, Daniel Amey, Karl Dietz, Sounak Banerji), In IEEE Transactions on Advanced Packaging, volume 30, 2007. [bib]
[2007] Multilayered Finite-Difference Method (M-FDM) for Modeling of Package and Printed Circuit Board Planes (A. Ege Engin, Krishna Bharath, Madhavan Swaminathan), In IEEE Transactions on Electromagnetic Compatibility, volume 49, 2007. [bib]
[2007] Causality enforcement in transient co-simulation of signal and power delivery networks (R. Mandrekar, K. Srinivasan, E. Engin, M. Swaminathan), In IEEE Transactions on Advanced Packaging, volume 30, 2007. [bib]
[2006] Modeling of Striplines between a Power and a Ground Plane (A. Ege Engin, Werner John, Grit Sommer, Wolfgang Mathis, Herbert Reichl), In IEEE Transactions on Advanced Packaging, volume 29, 2006. [bib]
[2006] Stopband Analysis Using Dispersion Diagram for Two-dimensional Electromagnetic Bandgap Structures in Printed Circuit Boards (Yoshitaka Toyota, Arif Ege Engin, Tae Hong Kim, Madhavan Swaminathan), In IEEE Microwave and Wireless Components Letters, volume 16, 2006. [bib]
[2005] Closed-form network representations of frequency-dependent RLGC parameters (A. Ege Engin, Wolfgang Mathis, Werner John, Grit Sommer, Herbert Reichl), In International Journal of Circuit Theory and Applications, volume 33, 2005. [bib]

Refereed Conference Papers

[2019] Flip-Chip Underfill RF Characterization (Robert B. Paul, A. Ege Engin, Jerry Aguirre), In International Symposium on Microelectronics, 2019. [bib]
[2018] Differential-Line Characterization Using Mixed-Port Scattering Parameters (A. E. Engin, I. Ndip, K. D. Lang, J. Aguirre), In IEEE NEMO, 2018. [bib]
[2018] Mixed-Mode Hybrid Parameters for High-Speed Differential Lines (A. E. Engin, I. Ndip, K. D. Lang), In International Symposium on Microelectronics, 2018. [bib]
[2017] Dielectric Thickness, Constant, and Loss Tangent Characterization of Ceramic Substrates (A. E. Engin, J. Aguirre, J. Walker, E. Graddy), In IMAPS CICMT, 2017. [bib]
[2017] Resonant-plane common-mode filter in differential lines (N. P. Modi, A. Olivera, A. E. Engin, H. Oomori), In 2017 IEEE CPMT Symposium Japan (ICSJ), volume , 2017. [bib] [doi]
[2016] Electrical Characterization of Low-Profile Copper Foil for Reduced Surface Roughness Loss - Best Paper of the Session Award (Qianfei Su Su, A. Ege Engin, Jerry Aguirre), In International Symposium on Microelectronics, 2016. [bib]
[2016] Determination of Dielectric Thickness, Constant, and Loss Tangent from Cavity Resonators (A. E. Engin, I. Ndip, K. D. Lang, G. Aguirre), In IEEE EPTC, 2016. [bib]
[2016] Non-Overlapping Power/Ground Planes for Localized Power Distribution Network Design (A. E. Engin, I. Ndip, K. D. Lang, G. Aguirre), In IEEE EDAPS, 2016. [bib]
[2016] Stepped-impedance common-mode filter in differential lines (A. E. Engin), In 2016 IEEE CPMT Symposium Japan (ICSJ), 2016. [bib] [doi]
[2016] Higher-order virtual ground fence design for filtering power plane noise (A. E. Engin, I. Ndip, K. D. Lang), In 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI), 2016. [bib] [doi]
[2015] Power archipelago for GHz power filtering on printed circuit boards (C. Ferguson, A.E. Engin), In Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on, 2015. [bib] [doi]
[2014] Dielectric Constant, Loss Tangent, and Surface-Roughness Loss Characterization of Ceramic Substrates (Hansel Dsilva, A. Ege Engin), In IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT),, 2014. [bib]
[2014] Virtual ground fence options for shielding power plane noise (A. Ege Engin, J. Bowman), In Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on, 2014. [bib] [doi]
[2014] Generalized Debye Model for PCB Dielectrics and Conductors (A. Ege Engin, Eva Kozachenko), In EMC'14 Tokyo, volume , 2014. [bib]
[2013] Equivalent circuit model extraction for interconnects in 3D ICs (A.E. Engin), In Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific, 2013. [bib] [doi]
[2012] Virtual Ground Fence for Power Filtering on IC Packages and Printed Circuit Boards (Jesse Bowman, A. Ege Engin), In IMAPS Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging, volume , 2012. [bib]
[2012] Virtual Ground Fence: A Simple Method for Protection against High Frequency Simultaneous Switching Noise (Jesse Bowman, A. Ege Engin), In IMAPS 45th International Symposium on Microelectronics, 2012. [bib]
[2012] High Frequency Signal Propagation in Through Silicon Vias (Srinidhi Raghavan N., A. Ege Engin), In IMAPS 45th International Symposium on Microelectronics, 2012. [bib]
[2012] Metal Semiconductor (MES) TSVs in 3D ICs: Electrical Modeling and Design (A. Ege Engin, Srinidhi Raghavan N.), In IEEE International 3D System Integration Conference (3DIC), volume , 2012. [bib] [doi]
[2012] Macromodeling of complex power delivery networks for efficient transient simulation (A.E. Engin, B. Adepu, M. Kusumoto, T. Harada), In CPMT Symposium Japan, 2012 2nd IEEE, 2012. [bib] [doi]
[2012] Power distribution network design and characterization using virtual ground fence (A.E. Engin, J. Bowman), In Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th, 2012. [bib] [doi]
[2012] Modeling of coupled TSVs in 3D ICs (A.E. Engin, N.S. Raghavan), In Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on, 2012. [bib] [doi]
[2012] Virtual ground fence: A methodology for GHz power filtering on printed circuit boards (A. Ege Engin, Jesse Bowman), In Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on, volume , 2012. [bib] [doi]
[2011] Automated Dielectric Constant and Loss Tangent Characterization Using Cavity Resonators (Pavithra Pasunoori, A. Ege Engin), In Electromagnetic Compatibility, 2011. EMC 2011. IEEE International Symposium on, volume , 2011. [bib]
[2011] A Novel Approach to the Measurement and Characterization of Losses due to Surface Roughness in High Speed Transmission Lines (Femi Akinwale, A. Ege Engin), In IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT),, 2011. [bib]
[2011] Analytical Modeling of Coupled TSVs in 3D ICs (A. Ege Engin, Srinidhi Raghavan N.), In IMAPS System Packaging Workshop, volume , 2011. [bib] [doi]
[2010] Debye Model Fitting for Time-Domain Modeling of Lossy Dielectrics (A. Ege Engin), In IMAPS 43rd International Symposium on Microelectronics, 2010. [bib]
[2010] Worst-case noise prediction with non-zero current transition times for early power distribution system verification (Peng Du, Xiang Hu, Shih-Hung Weng, A. Shayan, Xiaoming Chen, A. Ege Engin, Chung-Kuan Cheng), In Quality Electronic Design (ISQED), 2010 11th International Symposium on, volume , 2010. [bib] [doi]
[2010] On-chip power network optimization with decoupling capacitors and controlled-ESRs (Wanping Zhang, Ling Zhang, A. Shayan, Wenjian Yu, Xiang Hu, Zhi Zhu, E. Engin, Chung-Kuan Cheng), In Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific, volume , 2010. [bib] [doi]
[2009] Extraction of Dielectric Constant and Loss Tangent of Microwave Substrates using Full Sheet Resonance Method - Best Paper of the Session Award (A. Ege Engin), In IMAPS Advanced Technology Workshop On RF And Microwave Packaging, 2009. [bib]
[2009] Reduction of Signal Line to Power Plane Coupling Using Controlled-Return-Current Transmission Lines (A. Ege Engin, Ivan Ndip), In International Symposium on Microelectronics, 2009. [bib]
[2009] 3D stacked power distribution considering substrate coupling (A. Shayan, Xiang Hu, Wanping Zhang, Chung-Kuan Cheng, A.E. Engin, Xiaoming Chen, M. Popovich), In Computer Design, 2009. ICCD 2009. IEEE International Conference on, volume , 2009. [bib] [doi]
[2009] Comparison of electromagnetic field distribution in vicinity of patch and slot antennas (F. Ohnimus, I. Ndip, E. Engin, S. Guttowski, H. Reichl), In Antennas Propagation Conference, 2009. LAPC 2009. Loughborough, volume , 2009. [bib] [doi]
[2009] Study on shielding effectiveness of mushroom-type electromagnetic bandgap structures in close proximity to patch antennas (F. Ohnimus, I. Ndip, E. Engin, S. Guttowski, H. Reichl), In Antennas Propagation Conference, 2009. LAPC 2009. Loughborough, volume , 2009. [bib] [doi]
[2009] A New Multi-Dimensional RF and Microwave Modeling Algorithm Based on Rational Interpolants and Hybrid Mapping (A. Kashi, N. Roy, E. Engin, V. Devabhaktuni), In Signal Integrity and High-Speed Interconnects, 2009. IMWS 2009. International Microwave Workshop Series on, volume , 2009. [bib] [doi]
[2009] Predicting the worst-case voltage violation in a 3D power network (Wanping Zhang, Wenjian Yu, Xiang Hu, Amirali Shayan, A. Ege Engin, Chung-Kuan Cheng), In SLIP '09: Proceedings of the 11th international workshop on System level interconnect prediction, ACM, 2009. [bib] [doi]
[2009] On the bound of time-domain power supply noise based on frequency-domain target impedance (Xiang Hu, Wenbo Zhao, Peng Du, Yulei Zhang, Amirali Shayan, Christopher Pan, A. Ege Egin, Chung-Kuan Cheng), In SLIP '09: Proceedings of the 11th international workshop on System level interconnect prediction, ACM, 2009. [bib] [doi]
[2009] Prediction of high-performance on-chip global interconnection (Yulei Zhang, Xiang Hu, Alina Deutsch, A. Ege Engin, James F. Buckwalter, Chung-Kuan Cheng), In SLIP '09: Proceedings of the 11th international workshop on System level interconnect prediction, ACM, 2009. [bib] [doi]
[2008] Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions (Ki Jin Han, M. Swaminathan, E. Engin), In Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, volume , 2008. [bib] [doi]
[2008] Analysis of Horizontal and Vertical Couplings in Bonding Wire Interconnections Using EFIE with Cylindrical Conduction Mode Basis Functions (Ki Jin Han, M. Swaminathan, E. Engin), In Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on, volume , 2008. [bib] [doi]
[2008] Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects (Ki Jin Han, M. Swaminathan, Ege Engin), In Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE, volume , 2008. [bib] [doi]
[2008] Power transmission lines: A new interconnect design to eliminate simultaneous switching noise (A.E. Engin, M. Swaminathan), In Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, volume , 2008. [bib] [doi]
[2008] Noise induced jitter in differential signaling (J. Chandrasekhar, E. Engin, M. Swaminathan, K. Uriu, T. Yamada), In Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, volume , 2008. [bib] [doi]
[2008] Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM (K. Bharath, E. Engin, M. Swaminathan), In Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE, volume , 2008. [bib] [doi]
[2008] Wideband electrical modeling of large three-dimensional interconnects using accelerated generation of partial impedances with cylindrical conduction mode basis functions (Ki Jin Han, Madhavan Swaminathan, Ege Engin), In Microwave Symposium Digest, 2008 IEEE MTT-S International, volume , 2008. [bib] [doi]
[2007] Miniaturization of Electromagnetic Bandgap (EBG) Structures with High-Permeability Magnetic Metal Film (Yoshitaka Toyota, Kengo Iokibe, Ryuji Koga, Arif Ege Engin, Tae Hong Kim, Madhavan Swaminathan), In IEEE International Symposium on Electromagnetic Compatibility, 2007. [bib]
[2007] Compact Electromagnetic Bandgap Structures for Power Plane Isolation Using High-K Dielectrics - Best Paper Award Finalist in Board-Level Design Category (Abdemanaf Tambawala, Ege Engin, Madhavan Swaminathan, Pranabes Pramanik, Kazuhiro Yamazaki, John Andresakis), In DesignCon, 2007. [bib]
[2007] Electromagnetic Bandgap Structures - Design, Modeling and Integration in Mixed Signal Modules - Best Paper of the Session Award (Madhavan Swaminathan, Tae Hong Kim, Ege Engin, Abdemanaf Tambawala), In International Symposium on Microelectronics, 2007. [bib]
[2007] Modeling of Signal and Power Integrity in System on Package Applications (Madhavan Swaminathan, Arif Ege Engin), In IEEE International Symposium on Electromagnetic Compatibility, 2007. [bib]
[2007] Fast FDTD simulation of multiscale 3D models using laguerre-MNA (K. Srinivasan, E. Engin, M. Swaminathan), In Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on, volume , 2007. [bib] [doi]
[2007] Choosing the Right Number of Basis Functions in Multiscale Transient Simulation Using Laguerre Polynomials (K. Srinivasan, P. Yadav, E. Engin, M. Swaminathan), In Proc. Electrical Performance of Electronic Packaging, 2007. [bib]
[2007] Fast FDTD Simulation Using Laguerre Polynomials in MNA Framework (Krishna Srinivasan, Ege Engin, Madhavan Swaminathan), In IEEE International Symposium on Electromagnetic Compatibility, 2007. [bib]
[2007] Enhancement of Laguerre-FDTD with Initial Conditions for Fast Transient EM/Circuit Simulation (Krishna Srinivasan, Madhavan Swaminathan, Ege Engin), In Proc. Electronic Components and Technology Conference, 2007. [bib]
[2007] Electrical Characterization and Design Optimization of Embedded Chip in Substrate Cavities (N. Sankaran, B.-W. Lee, V. Sundaram, E. Engin, M. Iyer, M. Swaminathan, R. R. Tummala), In Proc. Electronic Components and Technology Conference, 2007. [bib]
[2007] I/O Decoupling in High Speed Packages Using Embedded Planar Capacitors (Prathap Muthana, Krishna Srinivasan, Ege Engin, Madhavan Swaminathan, Rao Tummala, Daniel Amey, Karl Dietz, Sounak Banerji), In Proc. Electronic Components and Technology Conference, 2007. [bib]
[2007] Placement and Routing of RF Embedded Passive Designs In {LCP} Substrate (Mohit Pathak, Souvik Mukherjee, Madhavan Swaminathan, Ege Engin, Sung Kyu Lim), In {IEEE} International Conference on Computer Design, 2007. [bib]
[2007] Automated Tool for Electromagnetic Band Gap (EBG) Synthesis in Mixed Signal Applications (Tae Hong Kim, Ege Engin, M. Swaminathan, P. Yadav), In Microwave Conference, 2007. APMC 2007. Asia-Pacific, volume , 2007. [bib] [doi]
[2007] Cylindrical Conduction Mode Basis Functions for Modeling of Inductive Couplings in System-in-Package (SiP) (Ki Jin Han, Ege Engin, Madhavan Swaminathan), In Proc. Electrical Performance of Electronic Packaging, 2007. [bib]
[2007] Causal Modeling and Extraction of Dielectric Constant and Loss Tangent for Thin Dielectrics (Arif Ege Engin, Abdemanaf Tambawala, Madhavan Swaminathan, Pranabes Pramanik, Kazuhiro Yamazaki), In IEEE International Symposium on Electromagnetic Compatibility, 2007. [bib]
[2007] Frequency-Dependent Dielectric Constant and Loss Tangent Characterization of Thin Dielectrics Using a Rapid Solver (Arif Ege Engin, Abdemanaf Tambawala, Madhavan Swaminathan, Swapan Bhattacharya, Pranabes Pramanik, Kazuhiro Yamazaki), In Proc. Electronic Components and Technology Conference, 2007. [bib]
[2007] Analysis for Signal and Power Integrity Using the Multilayered Finite Difference Method (Arif Ege Engin, Krishna Bharath, Madhavan Swaminathan), In ISCAS, 2007. [bib]
[2007] Computationally Efficient Power Integrity Simulation for System-on-Package Applications (K. Bharath, E. Engin, M. Swaminathan, K. Uriu, T. Yamada), In Design Automation Conference, 2007. DAC '07. 44th ACM/IEEE, volume , 2007. [bib] [doi]
[2007] Signal and Power Integrity Co-Simulation for Multi-Layered System on Package Modules (Krishna Bharath, Arif Ege Engin, Madhavan Swaminathan, Kazuhide Uriu;, Toru Yamada), In IEEE International Symposium on Electromagnetic Compatibility, 2007. [bib]
[2007] Efficient Simulation of Power/Ground Planes for {SiP} Applications (Krishna Bharath, Ege Engin, Madhavan Swaminathan, Kazuhide Uriu, Toru Yamada), In Proc. Electronic Components and Technology Conference, 2007. [bib]
[2006] Causal Transient Simulation of Passive Networks with Fast Convolution (Rohan Mandrekar, Krishna Srinivasan, Ege Engin, Madhavan Swaminathana), In Proc. IEEE Workshop on Signal Propagation on Interconnects, 2006. [bib]
[2006] System level signal and power integrity analysis methodology for System-In-Package applications (R. Mandrekar, K. Bharath, K. Srinivasan, E. Engin, M. Swaminathan), In Design Automation Conference, 2006. [bib]
[2006] Modeling of EBG Structures Using the Transmission Matrix Method (Krishna Bharath, Ege Engin, Toyota Yoshitaka, Madhavan Swaminathan), In Proc. Progress In Electromagnetics Research Symposium, 2006. [bib]
[2006] Finite Difference Modeling of Multiple Planes in Packages (A. Ege Engin, Madhavan Swaminathan, Yoshitaka Toyota), In International Zurich Symposium on Electromagnetic Compatibility, 2006. [bib]
[2006] A Novel Synthesis Method for Designing Electromagnetic Band Gap (EBG) Structures in Packaged Mixed Signal Systems - Outstanding poster paper award (Tae Hong Kim, Daehyun Chung, Ege Engin, Madhavan Swaminathan), In Proc. Electronic Components and Technology Conference, 2006. [bib]
[2006] Eye-Pattern Improvement for Design of High-Speed Differential Links Using Passive Equalization (Ki Jin Han, Hayato Takeuchi, Ege Engin, Madhavan Swaminathan), In Proc. Electrical Performance of Electronic Packaging, 2006. [bib]
[2006] Causal Transient Simulation of Systems Characterized by Frequency-Domain Data in a Modified Nodal Analysis Framework (S. N. Lalgudi, K. Srinivasan, G. Casinovi, R. Mandrekar, E. Engin, M. Swaminathan, Y. Kretchmer), In Proc. Electrical Performance of Electronic Packaging, 2006. [bib]
[2006] Switching Noise Suppression in Mixed Signal System Applications Using Electromagnetic Band Gap {(EBG)} Synthesizer (Tae Hong Kim, Ege Engin, Madhavan Swaminathan), In Proc. Electrical Performance of Electronic Packaging, 2006. [bib]
[2006] Finite-Difference Modeling of Noise Coupling between Power/Ground Planes in Multilayered Packages and Boards (A. Ege Engin, Krishna Bharath, Madhavan Swaminathan, Moises Cases, Bhyrav Mutnury, Nam Pham, Daniel N de Araujo, Erdem Matoglu), In Proc. Electronic Components and Technology Conference, 2006. [bib]
[2006] Dielectric Constant and Loss Tangent Characterization of Thin High-K Dielectrics Using Corner-to-Corner Plane Probing (A. Ege Engin, Abdemanaf Tambawala, Madhavan Swaminathan, Swapan Bhattacharya, Pranabes Pramanik, Kazuhiro Yamazaki), In Proc. Electrical Performance of Electronic Packaging, 2006. [bib]
[2006] Efficient Modeling of Package Power Delivery Networks with Fringing Fields and Gap Coupling in Mixed Signal Systems (Krishna Bharath, Ege Engin, Madhavan Swaminathan, Kazuhide Uriu, Toru Yamada), In Proc. Electrical Performance of Electronic Packaging, 2006. [bib]
[2006] Effect of EBG Structures for Reducing Noise in Multi-Layer PCBs for Digital Systems (Daehyun Chung, Tae Hong Kim, Chunghyun Ryu, Ege Engin, Madhavan Swaminathan, Joungho Kim), In Proc. Electrical Performance of Electronic Packaging, 2006. [bib]
[2006] Tailoring the Temperature Coefficient of Capacitance (TCC), Dielectric Loss and Capacitance Density with Ceramic-Polymer Nanocomposites for {RF} Applications (Isaac Robin Abothu, Baik-Woo Lee, P. Markondeya Raj, Ege Engin, Prathap Muthana, Chong K Yoon, Madhavan Swaminathan, Rao R. Tummala), In Proc. Electronic Components and Technology Conference, 2006. [bib]
[2006] Modeling of Multilayered Packages and Boards using Modal Decomposition and Finite Difference Methods (A. Ege Engin, Krishna Bharath, Krishna Srinivasan, Madhavan Swaminatha), In IEEE International Symposium on Electromagnetic Compatibility, 2006. [bib]
[2006] Stopband Prediction with Dispersion Diagram for Electromagnetic Bandgap Structures in Printed Circuit Boards (Yoshitaka Toyota, Arif Ege Engin, Tae Hong Kim, Madhavan Swaminathan, Kazuhide Uriu), In IEEE International Symposium on Electromagnetic Compatibility, 2006. [bib]
[2006] Enhancement of Signal Integrity and Power Integrity with Embedded Capacitors in High-Speed Packages (K. Srinivasan, P. Muthana, R. Mandrekar, E. Engin, J. Choi, M. Swaminathan), In International Symposium on Quality Electronic Design, 2006. [bib]
[2006] Analysis and Design of Electromagnetic Bandgap (EBG) Structures for Power Plane Isolation Using 2D Dispersion Diagrams and Scalability (A. Ege Engin, Yoshitaka Toyota, Tae Hong Kim, Madhavan Swaminathan), In Proc. IEEE Workshop on Signal Propagation on Interconnects, 2006. [bib]
[2006] Size Reduction of Electromagnetic Bandgap (EBG) Structures with New Geometries and Materials (Yoshitaka Toyota, A. Ege Engin, Madhavan Swaminathan, Swapan Bhattacharya), In Proc. Electronic Components and Technology Conference, 2006. [bib]
[2005] 3D Integration and Characterization Of High Q Passives On Multilayer Liquid Crystalline Polymer (M-LCP) Based Substrate (Wansuk Yun, Amit Bavisi, Venky Sundaram, Madhavan Swaminathan, Ege Engin), In Asia Pacific Microwave Conference, 2005. [bib]
[2005] Power Integrity/Signal Integrity Co-simulation for Fast Design Closure (Krishna Srinivasan, Rohan Mandrekar, Ege Engin, Madhavan Swaminathan), In Proc. Electronics Packaging Technology Conference, 2005. [bib]
[2005] Co-simulation of Signal and Power Delivery Networks with Causality (Rohan Mandrekar, Krishna Srinivasan, Ege Engin, Madhavan Swaminathan), In Proc. Electrical Performance of Electronic Packaging, 2005. [bib]
[2005] Mid Frequency Decoupling Using Embedded Decoupling Capacitors (Prathap Muthana, Madhavan Swaminathan, Ege Engin, P Markondeya Raj, Rao Tummala), In Proc. Electrical Performance of Electronic Packaging, 2005. [bib]
[2005] Design, Modeling and Characterization of Embedded Capacitor Networks for Mid-frequency Decoupling in Semiconductor Systems (Prathap Muthana, Madhavan Swaminathan, Rao Tummala, P.Markondeya Raj, Ege Engin, Lixi Wan, Devarajan Balaraman, Swapan Bhattacharya), In IEEE International Symposium on Electromagnetic Compatibility, 2005. [bib]
[2005] Measurement, Modeling and Characterization of Embedded Capacitors for Power Delivery in the Mid-Frequency Range (Prathap Muthana, Ege Engin, Madhavan Swaminathan, Rao Tummala, Venkatesh Sundaram, Lixi Wan, S.K Bhattacharya, P.M. Raj, K.J. Lee, Mahesh Varadarajan, Isaac Robin Abothu), In Annual Symposium on Microelectronics, 2005. [bib]
[2004] Three-wire analysis model to predict SI and EMC effects (Ege Engin, Mart Coenen, Heiko Köhne, Grit Sommer, Werner John), In Proc. EMC'04 Sendai, volume , 2004. [bib]
[2004] Lumped Skin-Effect Model for Interconnects (A. Ege Engin, Wolfgang Mathis, Werner John, Grit Sommer), In International Symposium on Signals, Systems, and Electronics ISSSE'04, volume , 2004. [bib]
[2004] Time-Domain Modeling of Skin Effect for Improved {SI} Analysis of Interconnect Systems and Packages (A. Ege Engin, Wolfgang Mathis, Werner John, Grit Sommer), In EUROEM'04, volume , 2004. [bib]
[2004] Three-Conductor Modeling of Striplines at Via Discontinuities (A. Ege Engin, Werner John, Grit Sommer, Wolfgang Mathis), In Proc. EMC'04 Sendai, volume , 2004. [bib]
[2004] Time-Domain Modeling of Lossy Substrates with Constant Loss Tangent (A. Ege Engin, Wolfgang Mathis, Werner John, Grit Sommer, Herbert Reichl), In Proc. IEEE Workshop on Signal Propagation on Interconnects, volume , 2004. [bib]
[2003] Modeling of Non-Ideal Planes in Stripline Structures (A. Ege Engin, Werner John, Grit Sommer, Wolfgang Mathis), In Proc. Electrical Performance of Electronic Packaging, volume , 2003. [bib]
[2003] Modeling and Analysis of the Return Path Discontinuity Caused by Vias using the 3-Conductor Model (A. Ege Engin, Mart Coenen, Heiko Köhne, Grit Sommer, Werner John), In IEEE International Symposium on Electromagnetic Compatibility, volume , 2003. [bib]
[2002] Three-Pole Analysis Model to Predict SI and EMC Effects (Ege Engin, Mart Coenen, Heiko Köhne, Grit Sommer, Werner John), In EMC Compo, 3rd International Workshop on Electromagnetic Compatibility of Integrated Circuits, volume , 2002. [bib]
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