San Diego State University - Minds That Move the World

San Diego State University

Department of Electrical and Computer Engineering

Skip repeated menu and go directly to page content.

The multiple GHz clock speeds of a microprocessorÂ’s internal logic typically cannot be maintained for its off-chip signals. The main bottleneck causing this IC vs. packaging performance gap is the electrical properties of interconnects and packages. They behave as distributed circuits, causing reflections, attenuation, dispersion, and crosstalk. Moreover, high-speed digital signals are affected by power supply noise, and cause increased electromagnetic interference due to discontinuities in the transmission-line reference planes.

Dr. Engin's research is in the area of electromagnetic interference with focus on signal/power integrity modeling and numerical electromagnetics applied to microelectronic packages and 3D stacked ICs. He has been researching new modeling and analysis methodologies for electrical design of interconnects, packages, and power delivery networks and has developed novel algorithms and design tools for advanced packaging that enables high-speed and high-performance systems.

Grants

Patents

Current Students

Qianfei Su

"Filled-Cavity Resonator Method for Complex Permittivity Measurement"


Vuong Tang

"Two-Stripline Method for Characterization of Copper Surface Roughness Loss"


Past Students

Chris Ferguson, MS Spring 2015, employed by Qualcomm

"Virtual Ground Fence Options for Shielding Power Plane Noise"


Hansel Dsilva, MS Fall 2015, employed by Intel

"High-Frequency Chip Package Characterization"


Eva Kozachenko, MS Spring 2014, employed by Rockwell Collins

"Passive Macromodeling Methodology For High-Speed Interconnects"


Courtney Bentow, MS Spring 2014, employed by L-3 Communications

"Coaxial And Parallel Plate Electrode Design And Measurement For Electroporation "


Jesse Bowman, MS Fall 2012, employed by Cubic

"The Virtual Ground Fence: A Micro-Strip Filtering Method Implemented Into Power Filter Design"


Srinidhi Raghavan N., MS Spring 2012, employed by Xilinx

"High-Frequency Signal Propagation in Through-Silicon Vias"


Oluwafemi Akinwale, MS Fall 2011, employed by Intel

"A Novel Approach to Characterization of Frequency Dependent Losses in Transmission Lines"


Pavithra Pasunoori, MS Fall 2010, employed by Quadgen Wireless Solutions

"Designing an Electro-Magnetic Simulator for Extraction of Material Properties of FR-4 And Low-Loss Materials"