[Scholarship_alert] Society of Photographic Instrumentation Engineers Scholarship Program

[Science & Engineering Scholarships Alert]

Title:            Scholarship 
Program 


Sponsor:          Society of Photographic Instrumentation Engineers

SYNOPSIS:  The Scholarship Program helps students studying
worldwide in an optics, photonics, imaging, or optoelectronics program
or related discipline.

Deadline(s):      02/15/2011
Established Date: 10/05/2010
Follow-Up Date:   11/01/2011
Review Date:      10/05/2010

Contact: 


Address:          PO Box 10
                   1000 20th St.
                   Bellingham, WA 98227-0010
                   U.S.A.
E-mail:           scholarships at spie.org
Web Site: http://spie.org
Program URL: http://spie.org/x7068.xml
Tel:              360 676 3290
Fax:              360 647 1445
Deadline Ind:     Receipt
Deadline Open:    No



Award Type(s):    Student Scholarship


Citizenship/Country of Applying Institution:
                   Any/No Restrictions

Locations Tenable:    Any/No Restrictions


Appl Type(s):     Graduate Student
                   Undergraduate Student


Target Group(s):  NONE
Funding Limit:    $11,000   MAXIMUM
Duration:         0
Indirect Costs:   Unspecified
Cost Sharing:     No
Sponsor Type:     NONE

Geo. Restricted:  NO RESTRICTIONS

CFDA#:

OBJECTIVES:  The Scholarship Program helps students studying
worldwide in an optics, photonics, imaging, or optoelectronics program
or related discipline.

ELIGIBILITY
  All students studying worldwide in an optics, photonics, imaging,
or optoelectronics program or related discipline are eligible to
apply, and must be a Member of SPIE.

FUNDING
  Individual scholarships range from $1,000 to $11,000.  (klc)

KEYWORDS:         ENGINEERING
                   Optical Communications
                   Optics
                   Optical Equipment
                   Electro-optical Technology
                   Photonics
                   Optoelectronics




-- 
This message has been scanned for viruses and
dangerous content by MailScanner, and is
believed to be clean.

-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://engineering.sdsu.edu/pipermail/scholarship_alert/attachments/20101006/be7ca9ac/attachment.htm>